Features:
Substrate material: FR4
External dimensions: 10.16 * 10.16mm
For SMD package: SOP spacing 1.27
Suitable pin number: backward compatible 6/4 pin
Thickness: 1.6mm
SMD pin pitch: 1.27mm fit
DIP pin pitch: 2.54mm (standard)
Uses: mainly used in the above transfer of SOP DIP packaged chips SMD package

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